| 摘要 |
PURPOSE: A method of manufacturing a semiconductor package is provided to reduce manufacturing costs of a semiconductor package by simplifying the number of a manufacturing process of the semiconductor package having a penetration electrode. CONSTITUTION: In a method of manufacturing a semiconductor package, a semiconductor chip(10) having a bonding pad(14), a fuse box(16), and a protective film(18) is formed. A blind via(25) faces the bottom side of the semiconductor chip from the top side. An oxide film pattern is formed on a fuse box. A low-temperature oxide(50) is formed on the top, inner side, and the bottom. The low-temperature oxide is h- etched to form a low temperature oxide film pattern. A metal seed film is formed in the low-temperature oxide pattern.
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