| 摘要 |
PURPOSE: A liquid adhesive composition of a semiconductor device is provided to ensure enough normal temperature stability, excellent adhesive force and mechanical strength when applied to a backside of a semiconductor wafer. CONSTITUTION: A liquid adhesive composition of a semiconductor device includes an epoxy resin in which a softening point is 50 °C or more; a hardener; a solvent which dissolves the epoxy resin and hardener and has a boiling point of 150 °C or more; and a polymer resin with molecular weight of 1,000~50,000 reactive with a hardening material in which the epoxy resin, hardener and solvent are mixed. |
