SEMICONDUCTOR PACKAGE HAVING DOUBLE SOLDER TYPE INPUT AND OUTPUT TERMINAL

摘要

PURPOSE: A semiconductor package having a double solder type input and an output terminal is provide to implement the secure holding of the input/output terminal and a fine pitch by forming the input/output terminal of a double solder structure. CONSTITUTION: In a semiconductor package having a double solder type input and an output terminal, a molding compound resin(14) is molded in one side of a chip making up a wafer level package(10). A penetration via(18) of a plurality of molding vias is penetrated through a molding compound resin. An input-output terminal(20) of a double solder structure is independently inserted into the penetration via and is melted in the bonding pad of a chip. The input/output terminal is comprised of a solder ball(22) and a conductive solder(24). The conductive solder is filled into the penetration via of molding resin.