| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a flip-chip package including a dam member preventing leakage of underfill between the mounting region of an electron device and connection pads. <P>SOLUTION: A flip-chip package 1 and a method of manufacturing the same are provided. The flip-chip package includes an electron device 16; a substrate 12, on which conductive pads 22 are formed inside the mounting region of the electron device and connection pads 14 are formed outside the mounting region; a resin layer R, that is formed on the substrate and includes a trench T, formed by partially removing the region; and a dam member 18a, that is provided on the trench to prevent leakage of underfill, between the mounting region of the electron device and the connection pads. The dam member is formed on the processed resin layer by preventing leakage of the underfill, which can reduce the fraction defective of the package and increase the connection reliability of the package. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
