| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for containing an element which is superior in heat dissipation, and to provide a mounting structure using the package for containing the element. <P>SOLUTION: The package for containing the element includes a substrate having a mounting area of the element on an upper surface, a frame which is provided along an outer circumference of the mounting area on the substrate, and partly has a through trench exposing the upper surface of the substrate, and an I/O terminal having a dielectric layer which is provided in the through trench, comes into contact with the exposed upper surface of the substrate, and extends inside and outside the frame, a signal line formed on an upper surface of the dielectric layer, and a ground layer formed on a lower surface of the dielectric layer. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
