PROCESS FOR MANUFACTURING CIRCUIT ASSEMBLY USING ELECTRODEPOSITABLE DIELECTRIC COATING COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a process for manufacturing a multilayer circuit assembly including a dielectric coating prepared by electrodeposition for forming a metalized via.

SOLUTION: A process for forming a metal via in a substrate is provided. The process includes a step of following: (I) providing an electrodepositable coating composition on the whole exposed surface of a substrate by electrophoresis to form a conformal dielectric coating on an electro conductive substrate. The electrodepositable coating composition contains a resin phase dispersed in a water phase. The resin phase includes: (a) an ionic group containing resin with a non-gel active hydrogen, and (b) a hardening agent reactive with the active hydrogen of the resin (a). The resin phase contains at least 1 wt.% of covalent bonded halogen content based on the total weight of a solid resin component present in the resin phase.

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