| 摘要 |
PROBLEM TO BE SOLVED: To separately operate respective semiconductor chips constituting a laminated semiconductor device, which are carried out common connection by a through electrode. SOLUTION: Each of chip automatic recognition selection circuits 900a-900e provided in stacked semiconductor chips includes: a frequency change circuit 12 (TFF circuit) for doubling and outputting the cycle of input pulse signals; a self address storage circuit (latch circuits LC1 to LC5) for fetching chip selection address signals B0, B1, and B2 commonly supplied to the semiconductor chips while the input logical level of the frequency change circuit 12 is different from those of all the other frequency change circuits 12, and storing the signals as self chip addresses; and a determination circuit (comparator circuit 13) for comparing the chip selection address with the self chip address to determine matching. COPYRIGHT: (C)2011,JPO&INPIT
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