| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for accurately performing line-shaped groove processing, such as dicing of a substrate and groove processing of a solar cell, by a simple masking method, since in a conventionally performed pattern cutting by sandblasting, a method using a photosensitive dry film as masking, and a method including printing masking ink by screen printing and performing masking, are costly and time consuming. SOLUTION: The slit-like groove processing is accurately performed, by jetting a polishing material and high pressure air jetted to the work substrate at a jetting angle of 30 degrees or below with respect to the work substrate, installing a masking plate formed with slit-shaped through-grooves in the jetting direction of the polishing material, and then moving the masking plate and a polishing material jetting nozzle in the inclination direction of the polishing material jetting nozzle. COPYRIGHT: (C)2011,JPO&INPIT
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