发明名称 SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY CARD USING THE SAME
摘要 A semiconductor memory device is provided with a wiring board which includes an element mounting portion and connection pads. Plural semiconductor memory elements are stacked on the element mounting portion of the wiring board. The semiconductor memory element of a lower side has a thickness greater than that of the semiconductor memory element of an upper side. The semiconductor memory elements are electrically connected to the connection pads of the wiring board via metal wires.
申请公布号 US2011110053(A1) 申请公布日期 2011.05.12
申请号 US201113009947 申请日期 2011.01.20
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NISHIYAMA TAKU;OKADA KIYOKAZU;ANDO YORIYASU;YAMAMOTO TETSUYA;OKUMURA NAOHISA
分类号 H05K1/18 主分类号 H05K1/18
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