| 发明名称 |
ADHESIVE COMPOSITION, CIRCUIT CONNECTING STRUCTURE, SEMICONDUCTOR DEVICE AND ADHESION IMPROVEMENT AGENT FOR GLASS |
| 摘要 |
<p>Disclosed are an adhesive composition containing a resin having piperazine skeletons, a circuit connecting structure, a semiconductor device, and an adhesion improvement agent for glass.</p> |
| 申请公布号 |
WO2011055580(A1) |
申请公布日期 |
2011.05.12 |
| 申请号 |
WO2010JP63554 |
申请日期 |
2010.08.10 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD.;KUDOU SUNAO;KOBAYASHI KOUJI;ARIFUKU MOTOHIRO;KUME MASAHIDE;MASUDA KATSUYUKI;EJIRI TAKAKO |
发明人 |
KUDOU SUNAO;KOBAYASHI KOUJI;ARIFUKU MOTOHIRO;KUME MASAHIDE;MASUDA KATSUYUKI;EJIRI TAKAKO |
| 分类号 |
C09J201/00;C03C27/10;C09D5/00;C09J7/00;C09J9/02;C09J11/00;C09J179/08;H01B1/22;H01B5/16;H01L21/60 |
主分类号 |
C09J201/00 |
| 代理机构 |
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代理人 |
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| 地址 |
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