发明名称 METHOD OF MANUFACTURING LED ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED element manufacturing method allowing batch mounting of many LED elements. <P>SOLUTION: The method at least includes: a step of cutting an LED element wafer stuck onto an expanded tape vertically and horizontally to form respective LED element chips and expanding the expanded tape up to a predetermined size; the positioning step of inserting the respective LED element chips on the expanded and enlarged expanded tape into openings in a positioning tool plate to bring corners of the respective LED element chips into contact with the corners of the openings in the tool plate and aligning the respective LED element chips at predetermined positions; and the step of putting and mounting the aligned LED element chips onto a circuit board. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011096961(A) 申请公布日期 2011.05.12
申请号 JP20090251812 申请日期 2009.11.02
申请人 CITIZEN ELECTRONICS CO LTD;CITIZEN HOLDINGS CO LTD 发明人 SEKIGUCHI KANETAKA
分类号 H01L33/48;H01L21/301 主分类号 H01L33/48
代理机构 代理人
主权项
地址