摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED element manufacturing method allowing batch mounting of many LED elements. <P>SOLUTION: The method at least includes: a step of cutting an LED element wafer stuck onto an expanded tape vertically and horizontally to form respective LED element chips and expanding the expanded tape up to a predetermined size; the positioning step of inserting the respective LED element chips on the expanded and enlarged expanded tape into openings in a positioning tool plate to bring corners of the respective LED element chips into contact with the corners of the openings in the tool plate and aligning the respective LED element chips at predetermined positions; and the step of putting and mounting the aligned LED element chips onto a circuit board. <P>COPYRIGHT: (C)2011,JPO&INPIT |