发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To readily obtain the state of a substrate processing apparatus that is used for manufacturing a substrate of a printed wiring board or the like; and to prevent decrease in operating rate of production facility by performing maintenance of the facility in a proper timely manner. SOLUTION: The substrate processing apparatus includes: a means for carrying a substrate at a predetermined speed; a spray wand to which multiple spray nozzles are attached; a pump that supplies a processing liquid to the spray wand; and a pressure indicator provided at an optional position of a flow path in the pump and spray wand, and at an end point of the spray wand. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011096873(A) 申请公布日期 2011.05.12
申请号 JP20090249772 申请日期 2009.10.30
申请人 PANASONIC CORP 发明人 EBARA JUN;HIGA KAZUTOMO
分类号 H05K3/06;C23F1/08 主分类号 H05K3/06
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