A PRINTED CIRCUIT BOARD AND A FABRICATING METHOD THE SAME

摘要

PURPOSE: A printed circuit board and a method for manufacturing the same are provided to increase the operational yield by simplifying a multi layers connected structure forming process. CONSTITUTION: A base substrate includes a circuit layer. The circuit layer is in connection with a first via. The first via passes through an insulating layer. A build-up layer(120) is stacked on the base substrate. An interlayer connection material includes at least part of the first via. The interlayer connection material includes a via-hole(160). The via-hole passes through the build-up layer. The interlayer connection material is a conductive layer or a conductive paste.