| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of stably performing electrical connection between connecting parts possessed by an interposer and a semiconductor chip which are laminated, and high in productivity, a semiconductor device, a manufacturing method of an electronic part high in the reliability of connection, and the electronic part. <P>SOLUTION: The problem can be solved by the following steps. First, a resin composition and a conductive connection material having a laminated structure constituted of metal foil selected from solder foil or tin foil are interposed between an interposer and a semiconductor chip. Then, they are heated for the purpose of melting the metal foil, and the molten metal foil is aggregated and solidified between a connection electrode of the interposer and a connection electrode of the semiconductor chip. After that, the resin composition is hardened and aggregated, thereby achieving fixation between a semiconductor wafer and the semiconductor chip. <P>COPYRIGHT: (C)2011,JPO&INPIT |
