| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve bonding strength by an insulating resin member with respect to a circuit device having a structure such that the insulating resin member is charged between stacked circuit modules. <P>SOLUTION: The circuit device 10 has the structure such that a second circuit module 200 is mounted on a first circuit module 100 with a solder ball 270 interposed therebetween, and an underfill 300 is charged between the first circuit module 100 and second circuit module 200. A circuit device 10 having such a structure has a side surface in level with an end surface of a first circuit module 100, an exposed surface of an underfill 300, and an end surface of a second circuit module 200. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
