| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent contamination of an adhesive from spreading around a resin-sealed heat sink after the adhesive having a polarity coated on an adhesion surface of the heat sink is melted by high heat generated when a lead is soldered. <P>SOLUTION: The heat sink 72 has main surfaces on top and bottom. One main surface is used as the adhesion surface 74 to be bonded with a heat dissipation board and the other main surface is bonded with the lead 11. A part of the resin-sealed heat sink 72 is coated with a water repellent film composed of a compound with a polar group and a nonpolar group. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
