| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate that has a pad for external connection to which a signal wiring conductor is connected through a signal through conductor, and can successfully transmit a high-frequency signal exceeding 25 GHz. SOLUTION: At least one of an upper conductor layer 8 for grounding or power supply and a lower conductor layer 9 for grounding or power supply has a strip-shaped protrusion 8b or 9b that extends toward the inside of a first opening 8a or a second opening 9a so as to be opposed to the signal wiring conductor 5. Since a capacitance component is formed between the signal wiring conductor 5, and the conductor layers 8 and 9 for grounding or power supply also in portions which correspond to the first opening 8a and the second opening 9a of the signal wiring conductor 5, the characteristic impedance of the signal wiring conductor 5 may be not increased rapidly. Consequently, the wiring substrate is capable of extremely efficiently transmitting the high-frequency signal exceeding 25 GHz. COPYRIGHT: (C)2011,JPO&INPIT |
