| 摘要 |
An object of the present invention is to provide a chip-size packaging device at low cost that achieves size reduction, thickness reduction, weight reduction, and further, high reliability, by using a glass substrate with a through electrode. The packaging device according to the present invention is characterized in that a glass substrate (11) having a plurality of through electrodes (11b) arranged at a predetermined position is used as a base member for a package that houses a device element having a group of electrodes, and the group of electrodes and the through electrodes (11b) are led out to an external circuit with a contact medium arranged to bypass a sealant (14) being interposed between the group of electrodes and the through electrodes (11b).
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