发明名称 System in Package High Power Highly Efficient Diode Lamp
摘要 A system in package, high power, and highly efficient diode lamp is provided. The diode lamp includes a heat-conducting/heat-dissipating module, a LED light module, an optical module, and a control circuit module. The heat-conducting/heat-dissipating module includes a heat-conducting device and at least one heat-dissipating fin. The LED light module is disposed on a flat portion of the heat-conducting device. The optical module focuses the light emitted by the LED light module. The control circuit module is used to control the LED light module. When the diode lamp is electrically connected to a power supply, the control circuit module selectively controls the LED light module to emit the light. The heat generated during the operation of the LED light module is conducted from the flat portion of the heat-conducting device to the at least one heat-dissipating fin, and then it is dissipated by the at least one heat-dissipating fin.
申请公布号 US2011110088(A1) 申请公布日期 2011.05.12
申请号 US201113006015 申请日期 2011.01.13
申请人 NEOBULB TECHNOLOGIES, INC. 发明人 CHEN JEN-SHYAN
分类号 F21S4/00;H01L33/50;H01L33/64 主分类号 F21S4/00
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