发明名称 POWER SUPPLY DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a power supply device for a vehicle, which efficiently cools semiconductor elements by using a cooling device even if some of the semiconductor elements are broken, and is high in reliability. <P>SOLUTION: The power supply device is equipped with: a first system inverter circuit 30A which has a plurality of the semiconductor elements 1A connected to a power supply via a first blocker 32A, and supplies power to a first driven body 33A; a second system inverter circuit 30B which has a plurality of the semiconductor elements 1B connected to the power supply via a second blocker 32B independent of the first blocker, and supplies power to a second driven body 33B; and the cooling device 4A which has at least one cooling unit provided with a heat receiving block having a first installation face to which the semiconductor elements constituting the first system inverter circuit are attached and a second installation face to which the semiconductor elements constituting the second system inverter circuit are attached, and a heat dissipation part connected to the heat receiving block, and cools the semiconductor elements. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011097673(A) 申请公布日期 2011.05.12
申请号 JP20090246773 申请日期 2009.10.27
申请人 TOSHIBA CORP 发明人 HASHIMOTO TAKASHI;TODA HIROHISA
分类号 H02M7/48;H02M7/5387 主分类号 H02M7/48
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