| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is reduced in size, without having to use a metal electrode plate by arranging a control board on the lead frame. <P>SOLUTION: In the semiconductor device 100 where the lead frame 20, a semiconductor element 3 bonded to the element arrangement surface of the lead frame, and the control board 5 for controlling the semiconductor element are resin-sealed by a mold resin 12, the lead frame includes a control board fixing part 11, which is bent in a direction normal to the element arrangement surface; and the control board is fixed to the control board fixing part and held over the element arrangement surface substantially in parallel therewith. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
