发明名称 Method of mounting a LED module to a heat sink
摘要 A method of mounting a light emitting diode (LED) module (100) to a heat sink (102), the method comprising the steps of placing the LED module (100) in a hole (120) in the heat sink (102); and expanding a portion of the LED module (100) such that the LED module (100) is secured to the heat sink (102). The method provides a cost efficient way of securing an LED module to a heat sink where the mount has a high reliability over time.
申请公布号 US2011111536(A1) 申请公布日期 2011.05.12
申请号 US200913002573 申请日期 2009.06.10
申请人 KONINKLOJKE PHILIPS ELECTRONICS N.V. 发明人 BRUNNER JOS GEORGE ANTONY;OEPTS WOUTER
分类号 H01L33/64 主分类号 H01L33/64
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