发明名称 |
Method of mounting a LED module to a heat sink |
摘要 |
A method of mounting a light emitting diode (LED) module (100) to a heat sink (102), the method comprising the steps of placing the LED module (100) in a hole (120) in the heat sink (102); and expanding a portion of the LED module (100) such that the LED module (100) is secured to the heat sink (102). The method provides a cost efficient way of securing an LED module to a heat sink where the mount has a high reliability over time.
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申请公布号 |
US2011111536(A1) |
申请公布日期 |
2011.05.12 |
申请号 |
US200913002573 |
申请日期 |
2009.06.10 |
申请人 |
KONINKLOJKE PHILIPS ELECTRONICS N.V. |
发明人 |
BRUNNER JOS GEORGE ANTONY;OEPTS WOUTER |
分类号 |
H01L33/64 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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