| 发明名称 |
SEMICONDUCTOR FLIP CHIP PACKAGE HAVING SUBSTANTIALLY NON-COLLAPSIBLE SPACER AND METHOD OF MANUFACTURE THEREOF |
| 摘要 |
A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.
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| 申请公布号 |
US2011108970(A1) |
申请公布日期 |
2011.05.12 |
| 申请号 |
US201113006697 |
申请日期 |
2011.01.14 |
| 申请人 |
|
发明人 |
LEE JAE SOO;KIM GEUN SIK;ALVAREZ SHEILA MARIE L.;QUIAZON ROBINSON;GOH HIN HWA;DAHILIG FREDERICK |
| 分类号 |
H01L23/495;H01L21/50;H01L23/48 |
主分类号 |
H01L23/495 |
| 代理机构 |
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