LEADFRAME AND METHOD OF MANUFACURING THE SAME

摘要

The present invention relates to a leadframe and a method for manufacturing the same. The leadframe includes a lead unit having vertical and horizontal parts, a die pad unit separated from the lead unit by an support unit formed of insulating material, an inner lead formed adjacent to the die pad unit and on the horizontal part of the lead unit, and an outer lead formed on a bottom surface of the vertical part of the lead unit. Such a structure of the leadframe shortens a wire length, allows flip chip bonding, and improves soldering adhesive. The structure of the leadframe enhances physical strength thereof by enhancing a support force of an insulator. Moreover, the leadframe includes a fine plating pattern having a small plating deviation and a superior structure, and has excellent durability and improved thermal conduction by entirely plating surfaces of the die pad.