发明名称 |
LED PACKAGE AND METHOD FOR FABRICATING THE SAME |
摘要 |
An LED package is disclosed herein. The disclosed LED package comprises a base having an LED chip mounted thereon, an encapsulation member formed by a light-transmittable resin to encapsulate the LED chip, and a housing formed to expose a top portion of the encapsulation member and to encompass a side surface of the encapsulation member, wherein the encapsulation member is formed by a transfer molding process using a mold to have a predetermined shape. Further, the housing may be light-transmittable.
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申请公布号 |
US2011108866(A1) |
申请公布日期 |
2011.05.12 |
申请号 |
US20080746447 |
申请日期 |
2008.12.02 |
申请人 |
SEOUL SEMICONDUCTOR COL, LTD. |
发明人 |
LEE CHUNG HOON;KIM YOON HEE;PARK BYUNG YEOL;KIM BANG HYUN;SEO EUN JUNG;KWON HYOUK WON |
分类号 |
H01L33/52;H01L33/48;H01L33/60 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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