发明名称 Nano-imprint template producing method for electronic component, involves joining chip and base together by adhesion and/or cohesion forces and/or using material engagement process, and withdrawing transfer body from upper side of chip
摘要 <p>The method involves structuring a silicon chip (2). The structured chip is placed on a base (3). A transfer body (1) is set on an upper side of the structured chip. The structured chip is incorporated through the body, positioned at a joint location above the base and is set in the location. The structured chip and the base are joined together by adhesion and/or cohesion forces and/or using a material engagement process. The body is withdrawn from the upper side of the structured chip. The body is designed to be elastic, chemically inert, particle-free, UV-transparent and UV-resistant. An independent claim is also included for a transfer body for producing a nano-imprint template.</p>
申请公布号 DE102010043235(A1) 申请公布日期 2011.05.12
申请号 DE20101043235 申请日期 2010.11.02
申请人 TECHNISCHE UNIVERSITAET DRESDEN 发明人 KIRCHNER, ROBERT;FISCHER, WOLF-JOACHIM
分类号 G03F7/00 主分类号 G03F7/00
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