发明名称 |
Nano-imprint template producing method for electronic component, involves joining chip and base together by adhesion and/or cohesion forces and/or using material engagement process, and withdrawing transfer body from upper side of chip |
摘要 |
<p>The method involves structuring a silicon chip (2). The structured chip is placed on a base (3). A transfer body (1) is set on an upper side of the structured chip. The structured chip is incorporated through the body, positioned at a joint location above the base and is set in the location. The structured chip and the base are joined together by adhesion and/or cohesion forces and/or using a material engagement process. The body is withdrawn from the upper side of the structured chip. The body is designed to be elastic, chemically inert, particle-free, UV-transparent and UV-resistant. An independent claim is also included for a transfer body for producing a nano-imprint template.</p> |
申请公布号 |
DE102010043235(A1) |
申请公布日期 |
2011.05.12 |
申请号 |
DE20101043235 |
申请日期 |
2010.11.02 |
申请人 |
TECHNISCHE UNIVERSITAET DRESDEN |
发明人 |
KIRCHNER, ROBERT;FISCHER, WOLF-JOACHIM |
分类号 |
G03F7/00 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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