PURPOSE: A light emitting diode lamp module is provided to improve thermal emission property and thermal saturated capacity by including a heat sink and using only single radiation wire substrate. CONSTITUTION: In a light emitting diode lamp module, a light-emitting diode package(200) comprises at least one light emitting diode A cross section heat dissipation wiring substrate mounts a light-emitting diode package in one side. The cross section heat dissipation wiring board comprises a plurality of holes The cross section heat dissipation wiring board emits the heat of the light-emitting diode package. A cooling fin(230) comprises a plurality of protrusions(232) which are fitted into the hole. The heat sink is formed on the other side of the cross section heat dissipation wiring board.
申请公布号
KR20110048791(A)
申请公布日期
2011.05.12
申请号
KR20090105509
申请日期
2009.11.03
申请人
KOREA PHOTONICS TECHNOLOGY INSTITUTE
发明人
KIM, YOUNG WOO;KIM, JAE PIL;KIM, MIN SUNG;SONG, SANG BIN;PARK, JOUNG WOK;LEE, KWANG CHEOL