| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To bond three or more substrates into one bonded substrate at high speed. <P>SOLUTION: A multilayer bonding method includes a step S12 of manufacturing a first bonded substrate by bonding an upper substrate and its intermediate substrate together in a bonding chamber, a step S13 of carrying its lower substrate in the bonding chamber when the first bonded substrate is arranged in the bonding chamber, and a step S14 of manufacturing a second bonded substrate by joining the first bonded substrate and its lower substrate together in the bonding chamber. In such a multilayer bonding method, its upper substrate can be bonded with its lower substrate without being taken out of the bonding chamber after being bonded with its intermediate substrate. Consequently, the second bonded substrate can be manufactured at high speed, so it is manufactured inexpensively. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
