ETCHING LIQUID FOR ETCHING SILICON SUBSTRATE REAR SURFACE IN THROUGH SILICON VIA PROCESS AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP HAVING THROUGH SILICON VIA USING THE ETCHING LIQUID

摘要

Disclosed is an etching liquid, which is used for etching a silicon substrate rear surface in a through silicon via process, etches only a silicon substrate without etching a connecting plug composed of a metal, such as copper and tungsten, or a polysilicon and the like, and has an excellent etching rate. Also disclosed is a method for manufacturing a semiconductor chip having a through silicon via, wherein the etching liquid is used. The etching liquid for etching a silicon substrate rear surface in a through silicon via process contains potassium hydroxide, hydroxylamine, and water. The method for manufacturing a semiconductor chip has a step of etching the rear surface of a silicon substrate using the etching liquid.