| 摘要 |
<p>A hybrid silicon wafer which is a silicon wafer characterized by having a structure wherein monocrystalline silicon is embedded in polycrystalline silicon that is produced by the unidirectional solidification melt method. The aforesaid hybrid silicon wafer which has a structure wherein the longitudinal plane of crystal grains of the polycrystalline silicon part, that is produced by the unidirectional solidification melt method, is referred to as a wafer plane and the monocrystalline silicon is embedded in such a manner that the longitudinal direction of the crystal grains of the polycrystalline silicon makes an angle of 120o-150o with respect to the cleavage plane of the monocrystalline silicon. Thus, a hybrid silicon wafer having the functions of both a polycrystalline silicon wafer and a monocrystalline silicon wafer is provided.</p> |
