| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high resolution and showing high flame retardancy after curing. <P>SOLUTION: The photosensitive resin composition comprises (A) a soluble polyimide having a polyoxypropylenediamine residue, (B) a chain or cyclic phosphazene compound having two or more acryloyloxy groups, methacryloyloxy groups or alkenyl groups in a molecule and having a repeating number of 1-20 as a photopolymerizable compound, and (C) a photoinitiator. <P>COPYRIGHT: (C)2011,JPO&INPIT |
