SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

Provided are a semiconductor device and method for manufacturing the same which make it possible for optical signals to be input and output with excellent optical coupling efficiency. The semiconductor device is provided with: an LSI chip (1); a package substrate (2); an optical element chip (3); and a flexible optical waveguide substrate (4). The LSI chip (1) and the optical element chip (3) are mounted on the upper face of the package substrate (2). The optical element chip (3) is electrically connected to the LSI chip (1) by way of the package substrate (2). One end of the flexible optical waveguide substrate (4) is optically coupled to the optical element chip (3), and the other end is arranged on the bottom face side of the package substrate.