发明名称 |
Semiconductor package and manufacturing method thereof |
摘要 |
There is provided a semiconductor package including: a circuit board having a receiving space formed therein; a semiconductor chip inserted into the receiving space of the circuit board; and an electrode pattern portion having a pattern shape on one surface of the semiconductor chip, and directly contacting a via portion of the circuit board so as to be electrically connected thereto.
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申请公布号 |
US2011108993(A1) |
申请公布日期 |
2011.05.12 |
申请号 |
US20100805334 |
申请日期 |
2010.07.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KANG JOON SEOK;KWEON YOUNG DO;PARK SEUNG WOOK;LEE JONG YUN;OH KYUNG SEOB |
分类号 |
H01L23/48;H01L21/50 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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