CONDUCTIVE ADHESIVE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE INCLUDING THE CONDUCTIVE ADHESIVE

摘要

The present invention relates to a conductive adhesive, to a method for manufacturing same, and to an electronic device including the conductive adhesive, wherein the conductive adhesive comprises: conductive particles; an alloy powder having a low melting point and including an alloy formed from one or more metals selected from the group consisting of Sn and Ag, Cu, Bi, Zn, In, and Pb; a nanopowder; a first binder including a heat-curable resin; and a second binder including a rosin compound.