| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding capillary preventing an aluminum electrode and a semiconductor element from being damaged due to transmission of excessive ultrasonic power regardless of wire bonding of a copper wire by an existing bonding device optimized for a gold wire. <P>SOLUTION: The bonding capillary includes a first cylinder section mechanically fixed to the bonding device, a conical section disposed on the bonding-performed side of the first cylinder section, and a bottleneck section formed on the bonding-performed side of the conical section. An attenuation section of a diameter which is smaller than that of an end on the bonding-performed side of the conical section and larger than that of an end on the side opposite to the bonding-performed side of the bottleneck section is formed between the conical section and the bottleneck section. <P>COPYRIGHT: (C)2011,JPO&INPIT |
