| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having good chemical resistance even in a system using an acid anhydride as a curing agent, showing little decrease in the light reflectance by heat treatment or UV irradiation treatment, and suitable for a printed wiring board, and to suppress vaporization of a curing agent and to improve a working environment. SOLUTION: The epoxy resin composition contains an epoxy resin as a main agent, and a curing agent and an inorganic filler, wherein the epoxy resin is an alicyclic epoxy resin, the curing agent is an acid anhydride, and the inorganic filler essentially comprises titanium dioxide. The addition amount of the curing agent is specified to 0.1 to 0.5 in terms of a reaction equivalent ratio to the epoxy resin. The curing agent is preferably an acid anhydride having an initial temperature of thermal decomposition of 120°C or higher. COPYRIGHT: (C)2011,JPO&INPIT |
