| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact buffer for efficiently radiating the heat of a printed wiring board without deteriorating shock absorption. SOLUTION: A damper 4 on a heat radiation side is vertically held between damper fixing metallic fittings 3, 5. The damper fixing metallic fittings 3 are pressure-bonded to the printed wiring board 6 through the use of an adhesive 8 with high thermal conductivity, and fastened together with the printed wiring board 6 and a damper 2 with the use of a screw 1. The damper fixing metallic fittings 3, 5 are processed to have cylindrically projected shapes, where the cylindrical parts of the damper fixing metallic fittings 3, 5 are superimposed on the inner side of the damper 4. A gap in the superimposition part of the damper fixing metallic fittings is filled with a filler material 7 with high thermal conductivity. The cylindrical shapes on the inner side of the superimposition part in the damper fixing metallic fittings are provided with a spring property which causes bending and extending outward. COPYRIGHT: (C)2011,JPO&INPIT
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