| 摘要 |
The invention relates inter alia to a method for producing an arrangement, in which (a) a first electrical component (60) is arranged on a first carrier (10), (b) a second electrical component (260) is arranged on a second carrier (200) and (c) the two carriers are connected to one another, wherein the sequence of steps (a) to (c) is arbitrary. According to the invention, the two carriers are adhesively bonded to one another with an adhesive (310) containing electrically conductive particles (300) so as to form an anisotropically conductive adhesive layer (320), wherein the adhesive layer is used to produce an electrical connection between at least one electrical contact surface (80) on the first carrier and at least one electrical contact surface (240) on the second carrier. |
