| 摘要 |
<p>Provided is a substrate connection structure capable of alleviating generation of warps on a flexible circuit board, in a connection between the flexible circuit board and a mounting body, or in a connection between the flexible circuit board and a printed circuit board. The substrate connection structure comprises a flexible circuit board (10) and a hard-type circuit board (20), and the flexible circuit board (10) and the hard type circuit board (20) are connected by thermocompression bonding. In the substrate connection structure, a reinforcement member (40) is installed on the face on the opposite side of a flexible circuit board (10) to the connection face thereof, and the reinforcement member (40) is arranged so that three sides thereof form an approximately U-shape along the exterior of the flexible circuit board (10). By adopting this configuration, the strength of a connection terminal section (13) of the flexible circuit board (10) can be improved, and heat can be conducted to adhesives more easily while generation of warps on the connecting terminal section (13) is alleviated. Furthermore, this configuration enables connection between the flexible circuit board (10) and the hard-type circuit board (20) to be carried out smoothly.</p> |
