| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device that is enhanced in adhesion strength between a lead to which a light emitting element is bonded, and a molding made from a resin. <P>SOLUTION: The light emitting device includes first and second leads which are isolated from each other, the light emitting element provided over the first and the second leads and having one terminal connected to the first lead and the other terminal connected to the second lead, and the molding made from the resin and covering the light emitting element, parts of upper and lower surfaces of the first and the second leads and parts of end surfaces, the remaining parts of the lower surfaces and the remaining parts of the end surfaces being exposed. At least one of the first and the second leads has a body having an end surface covered with the molding, an extension part extended from the body and having its lower surface covered with the molding and its tip end surface exposed to a side surface of the molding. An external shape of the molding forms an external shape of the light emitting device. <P>COPYRIGHT: (C)2011,JPO&INPIT |
