| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a photosensitive composition having high thermal cycle test resistance, high storage stability, and a smooth-shape inner surface when a via is formed; a photosensitive laminate using the photosensitive composition; a method for forming a permanent pattern; and a printed board. <P>SOLUTION: The photosensitive composition contains at least a binder, a polymerizable compound, and a filler. The binder has an acid group and ethylenically unsaturated bond in a side chain, and has any of a bisphenol A type skeleton and a bisphenol F type skeleton. The filler is spherical silica surface-treated with a silane coupling agent. <P>COPYRIGHT: (C)2011,JPO&INPIT |
