| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To attain wiring design facility on a mother board and wiring design facility on a module substrate. <P>SOLUTION: The multi-chip module (31) includes: a printed wiring board (PCB) having two or more lines of wiring; a data processing device provided with a first ball electrode disposed along a first side and a second ball electrode disposed along a second side and loaded on the printed wiring board through them; a first memory device provided with a first terminal disposed along a first memory long side and loaded adjacently on the printed wiring board through it so that a first long side is arranged side by side with the first side of the data processing device in the plane view; and a second memory device provided with a second terminal disposed along a second memory long side and loaded adjacent on the printed wiring board through it so that a second long side is arranged side by side with the second side of the data processing device in the plane view and a second memory corner part faces a first memory corner part. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
