发明名称 |
EPITAXIALLY LAMINATED III-NITRIDE SUBSTRATE |
摘要 |
Disclosed is an epitaxially laminated III-nitride substrate in which the crystallinity of a III-nitride semiconductor can be improved without increasing the amount of deflection of the substrate. Specifically disclosed is an epitaxially laminated III-nitride substrate comprising a base substrate, a buffer formed on the base substrate, and a main laminate formed on the buffer by epitaxially growing a III-nitride layer on the buffer. The substrate is characterized in that the buffer comprises an initial film-growth layer that is in contact with the base substrate, a first superlattice laminate that is formed on the initial film-growth layer, and a second superlattice laminate that is formed on the first superlattice laminate, the first superlattice laminate is produced by laminating 5 to 20 first AlN layers that comprise an AlN material and an equal number of second GaN layers that comprise a GaN material in an alternating manner, one pair of a first AlN layer and a second GaN layer has a thickness of less than 44 nm, and the second superlattice laminate is produced by laminating a plurality of first layers comprising an AlN material or an AlGaN material and second layers comprising an AlGaN material having a different band gap from that of the first layer in an alternating manner. |
申请公布号 |
WO2011055543(A1) |
申请公布日期 |
2011.05.12 |
申请号 |
WO2010JP06504 |
申请日期 |
2010.11.04 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD.;IKUTA, TETSUYA;SHIMIZU, JO;SHIBATA, TOMOHIKO |
发明人 |
IKUTA, TETSUYA;SHIMIZU, JO;SHIBATA, TOMOHIKO |
分类号 |
H01L21/338;H01L21/205;H01L29/201;H01L29/778;H01L29/812 |
主分类号 |
H01L21/338 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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