| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate for mounting an element, which improves connection reliability to a connection member, such as solder. <P>SOLUTION: A semiconductor device 10 has PoP structure, where a first electrode section 160 provided in the first substrate 110 for mounting an element for composing a first semiconductor module 100 and a second electrode section 242 provided in a second semiconductor module 200 are joined by a solder ball 270. A first insulating layer 150a including an opening is provided on one main surface of an insulating resin layer 130 serving as a base material, and the first electrode section 160, where a projecting top section projects from an upper surface of the first insulating layer 150a, is formed at the opening. A second insulating layer 152 provided on the first insulating layer is formed around the top of the first electrode section 160 separately from the top of the first electrode section 160. The shape of the top of the first electrode section 160 is formed by a curved surface, or by a curved surface and a plane smoothly connected to the curved surface. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
