MOUNTING APPARATUS AND METHOD FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a mounting apparatus for mounting semiconductor chips to a substrate with a higher accuracy.

SOLUTION: The mounting apparatus for electronic component is equipped with: a wafer table 2 for supplying semiconductor chips; a mounting tool 12 for picking up semiconductor chips provided on the wafer table; a chip camera 21 for taking an image of the semiconductor chip from the lower side before the semiconductor chip picked up with the mounting tool is mounted to the substrate; a substrate camera 23 for taking an image of the part of the substrate to which the semiconductor chip is mounted; an arithmetic processing part 16 for computing the location of a first aligning mark provided to the semiconductor chip based on imaging by the chip camera and computing the location of a second aligning mark provided to the substrate based on imaging by the substrate camera; and a drive control part 17 for mounting the semiconductor chip by positioning the mounting tool to the substrate based on the locations of the first aligning mark and the second aligning mark computed by the arithmetic processing part.

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