发明名称 MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting structure requiring a supporting member and side surface bonding, in which the electronic component is prevented from being detached from the supporting member even if an external force is applied to the structure. SOLUTION: The electronic component mounting structure includes an approximately plate-like electronic component 12 and a supporting member 13 having an opening 13a for supporting the approximately plate-like electronic component 12 by bonding it on its side surface portion. The approximately plate-like electronic component 12 is inserted from a front side into the opening 13a and in the supporting member 13, a back supporting part 13c is formed for supporting the approximately plate-like electronic component 12 from its back. Further, the approximately plate-like electronic component 12 is sealed in the back supporting part 13c of the supporting member 13 by an adhesive agent 14. Moreover, the supporting member 13 supports the approximately plate-like electronic component 12 together with a flexible substrate 11. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011097415(A) 申请公布日期 2011.05.12
申请号 JP20090250211 申请日期 2009.10.30
申请人 CASIO COMPUTER CO LTD 发明人 MATSUO KATSUYUKI
分类号 H04N5/225;G03B17/02;H05K1/18 主分类号 H04N5/225
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