发明名称 SUBSTRATE PACKAGE WITH THROUGH HOLES FOR HIGH SPEED I/O FLEX CABLE
摘要 An assembly of substrate packages interconnected with flex cables and a method of fabrication of the substrate package. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing separable inter-package flex cable connection. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I/O contact pads.
申请公布号 US2011108427(A1) 申请公布日期 2011.05.12
申请号 US201113008849 申请日期 2011.01.18
申请人 GURUMURTHY CHARAN;GANESAN SANKA;RAMASWAMY CHANDRASHEKAR;HLAD MARK 发明人 GURUMURTHY CHARAN;GANESAN SANKA;RAMASWAMY CHANDRASHEKAR;HLAD MARK
分类号 C25D5/02 主分类号 C25D5/02
代理机构 代理人
主权项
地址