发明名称 |
SUBSTRATE PACKAGE WITH THROUGH HOLES FOR HIGH SPEED I/O FLEX CABLE |
摘要 |
An assembly of substrate packages interconnected with flex cables and a method of fabrication of the substrate package. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing separable inter-package flex cable connection. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I/O contact pads.
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申请公布号 |
US2011108427(A1) |
申请公布日期 |
2011.05.12 |
申请号 |
US201113008849 |
申请日期 |
2011.01.18 |
申请人 |
GURUMURTHY CHARAN;GANESAN SANKA;RAMASWAMY CHANDRASHEKAR;HLAD MARK |
发明人 |
GURUMURTHY CHARAN;GANESAN SANKA;RAMASWAMY CHANDRASHEKAR;HLAD MARK |
分类号 |
C25D5/02 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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