SEMICONDUCTOR DEVICE AND RESIN COMPOSITION USED IN SEMICONDUCTOR DEVICE

摘要

A semiconductor device of the present invention (1) has a substrate (2); a semiconductor element (3) provided on at least one side of the substrate (2); a first resin (4) obtained by curing a first resin composition which fills a gap between the substrate (2) and the semiconductor element (3); and a second resin (5) which covers the substrate (2) and the first resin (4), and obtained by curing a second resin composition after the first resin composition is cured. In the present invention, adhesion strength between the first resin (4) and the second resin (5) is 18 MPa or larger at room temperature.