| 摘要 |
<p>Disclosed is an anti-fungal composition for wood materials, which is characterized by comprising at least one metal pyrithione compound selected from sodium pyrithione, zinc pyrithione and copper pyrithione and at least one copper compound selected from copper oxychloride, copper hydroxycarbonate, copper carbonate, copper sulfate, copper oxysulfate, copper acetate, copper oxide, copper naphthenate, cupric hydroxide, copper terephthalate, copper dodecylbenzenesulfonate bis(ethylenediamine), copper nonylphenolsulfonate, copper hydroxynonylbenzenesulfonate, copper polystyrene sulfonate and oxine copper. The anti-fungal composition can be used for preventing mold from getting on lumber, and can particularly prevent the contamination of woods by Zygomycetes fungi such as mucor fungi and rhizopus fungi effectively for a long period.</p> |
