| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer flexible wiring board, capable of simplifying a configuration and a manufacturing step, having superior flex-resistance and refraction-resistance properties and being readily thinned. SOLUTION: The multilayer flexible wiring board includes an insulating substrate 14; a pair of conductive layers 15, 16 provided on both surfaces of the insulating substrate 14; a pair of insulating layers 17, 19 provided on the pair of conductive layers 15, 16, respectively; and at least one outer layer circuit L3(18), L4(20) provided on the pair insulating layers 17, 19, respectively and electrically connected to the pair of conductive layer by a plating and/or conductive paste, rather than going via a coverlay. COPYRIGHT: (C)2011,JPO&INPIT |
